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Facilité d'utilisation
CAUTION Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 oC in an open chassis. Technical Reference Figure 17 shows the locations of the localized high temperature zones. Item Description A Processor voltage regulator area B Processor Figure 17. Localized High Temperature Zones Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 29. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel X79 Express Chipset 104 oC (under bias) For information about Refer to Processor datasheets and specification updates Section 1.3, page 16 Intel Desktop Board DX79TO Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 .C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 .C. The MTBF for the board is >100,000 hours. 2.8 Environmental Table 30 lists the environmental specifications for the board. Table 30. Environmental Specifications Parameter Specification Temperature Non-Operating -20 °C to +70 °C (Note) Operating 0 °C to +55 °C The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and 1 inch above the board, in a closed chassis, while the system is in operation. Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second. Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec.) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g. Hz sloping up to 0.02 g. Hz 20 Hz to 500 Hz: 0.02 g. Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g. Hz (flat) 40 Hz to 500 Hz: 0.015 g. Hz sloping down to 0.00015 g. Hz Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum operating temperature specified. It is recommended that the board temperature be at least room temperature before attempting to power on the board. Overview of BIOS Features 3.1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as SIX7910J.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the